SOLUTIONS

Your technology needs careful adaption to a new or higher industry standard.
Harsh or demanding environments depend on reliable rugged electronics and packaging to ensure maximum protection and optimized performance

COTS Ruggedization

YOU HAVE THE HARDWARE, WE HAVE THE RUGGED SOLUTION
STL Engineering oversees the entire mechanical and electrical design process to provide you with a rugged COTS solution that is ready for the field.

Analysis according to the environment
Suggestions for enhancements
Development of rugged solutions
Design and verification testing for environmental effects
Qualification Delivery

ADVANCED COOLING EXPERTISE
FOR YOUR UNIQUE NEEDS
Our highly-qualified team at STL Engineering designs rugged products and systems with different cooling strategies including:

Air-Cooled
Air Flow Through
Conduction-Cooled
Embedded Heat Pipes
Immersion Cooling
Liquid Flow Through
Liquid Flow in Micro-Channels
Piezoelectric Micro-Blower Fansink
Thermoelectric Coolers
And more...

YOU HAVE A HARDWARE SOLUTION

With the functionality you need.
The performance you need.
The software support you need.

BUT IT ISN'T RUGGED ENOUGH.

WE WILL:

Analyze it for the environment.
Propose enhancements.
Develop ruggedization solutions for deployment.
Implement, test and verify the solution.
Qualify it….Deliver it to you.

We can support the development of your custom solution or
a standard solution like the VPX AVRO...

Introducing the AVRO-2 Family

The AVRO-2 is a compact, 2-slot 3U VPX chassis designed specifically for high-powered conduction-cooled modules. The unit is multi-functional and able to accommodate a wide range of COTS modules such as a fully-featured Mission/Display computer, High Performance Embedded Computing (HPEC) or Graphics/Graphics Processing Unit (GPGPU) within a 2-slot solution.

WHAT IS AVRO-2D?

Specifically designed to host and control conduction-cooled VPX modules for customer demonstration, product evaluation, trade show and desktop development.
Supports two 3U VPX/Open VPX modules with mezzanines.
Up to 200W thermal power dissipation with optional fan tray.
Manages high power, high performance SBCs and GPGPUs.
Application specific I/O panel and backplane.
Eliminates need for developing and handling rear transition modules.
Seamless transition to the AVRO-2 rugged systems for deployment.

WHAT OTHER AVRO-2 OFFERINGS ARE THERE?

The AVRO-2 is versatile and deployable in a range of severe environments including airborne, low to medium altitude, ground vehicle, ship, ground station and more.

Specifically designed to support the use of conduction-cooled modules within extreme conditions, the chassis can be customized to meet the needs of any harsh environment.